Facilities, equipment, and other resources:

Space: 

·        My group's lab space includes rooms 001, 003, 308, and 504 in the Physical Science Center building and room 2 in the Neutron Generator building.

Magnets and Cryogenics:

·        Oxford Instruments 16-Tesla (64mm bore) Teslatron system with He4 and He3
(T = 280mK to 400K).

·        Cryogen free 2.8K/1.2T system consisting of a Cyromech pulsed-tube refrigerator in the bore of a GMW 3473 water-cooled electromagnet (with 3" and 6" pole faces, adjustable gap, and fields up to 2T).

·        Other dewar stations with smaller magnets (up to 5 Tesla) and a 40K closed-cycle helium refrigerator.

Electronics:

·        Pulsed current and voltage sources (compliance voltages up to 400 V, currents up to 500 A), high-speed high-CMRR differential amplifiers, and Labwindows acquisition and waveform analysis tools. Real-time current-voltage correlation on a sub-nanosecond time scale.

·        Digital storage oscilloscopes including LeCroy 204xi (200 GS/s RIS sampling rate, 4-channel), LeCroy LT322 (10 GS/s RIS, 2-channel), and LeCroy 7314 (2 GS/s RIS, 4-channel) plus other scopes.

·        Usual complement of other electronic instrumentation (lock-in amplifiers, current/voltage sources, digital multimeters, etc.)

Sample preparation and characterization:

·        Electron-beam lithography:  Nabity NPGS system (40 nm resolution).

·        Contact and projection photolithography (300 nm resolution) with Olympus BHM and Olympus BX40 metallurgical microscopes. The latter instrument has UV capable 1.25X-150X objectives, polarization, bright-field/dark-field, and DIC capabilities, and has a high-resolution digital camera.

·        Ion-milling system: Oxford Applied Research IG5 capable of argon and reactive-ion etching.

·        Multimode cryopumped vacuum deposition system with e-beam evaporation, RF and DC sputter sources, DC biased substrate holder with LN₂ cooling and heating up to 800^o C. Other UHV thermal-evaporation deposition system. Furnaces for oxygen annealing. Darkrooms, electrodeposition, fume hoods, micro-balance, and dry boxes.

·        Materials characterization and analysis facilities include a 0.14-nm-resolution scanning transmission electron microscope (STEM) with x-ray microanalysis, a 0.2-nm resolution TEM, an SEM, a TopoMetrix AFM/STM scanning probe microscope, a Nanoscope 1 STM, X-ray diffractometers.

Machine shop and tools:

·        Smithy lathe and mill. Taig micro lathe and micro mill. Band saw. Drill press. Full complement of hand power tools.

There are several additional resources located in the shared central facilities of the USC Nanocenter (http://www.nano.sc.edu/), Electron-microscopy center (http://www.emc.sc.edu/), and College Machine Shop.